Global materials and technology company Asahi Kasei has announced the development of a new photosensitive polyimide film designed to streamline advanced panel-level packaging for semiconductors. This innovative product combines the properties of Asahi’s photosensitive polyimide (PSPI) and dry film photoresist, and is currently under customer evaluation, with commercial availability anticipated soon, according to Australian Manufacturing.
Innovation in Semiconductor Packaging
The new PSPI film is a result of Asahi Kasei's expertise in manufacturing PIMEL liquid PSPI, traditionally used for buffer coatings and passivation layers, and SUNFORT dry film photoresist, which is used for temporary lithographic circuit patterning on substrates and wafers. This combination is expected to enhance productivity in semiconductor packaging by enabling an easy, uniform lamination process across large square panels, as reported by Asahi Kasei.
Strategic Implications for AI Chip Manufacturing
Nobuko Uetake, a senior executive officer at Asahi Kasei, highlighted the industry shifts driving this innovation. She noted that as AI semiconductor performance improves, advanced packaging requires technologies that cover larger areas and offer higher precision. The new PSPI film aims to contribute to improved yield and productivity, supporting the evolution of advanced semiconductor packaging, according to Asahi Kasei.
Impact on Women in Tech Leadership
This development also showcases the leadership role of Nobuko Uetake at Asahi Kasei, reflecting individual contributions of women in advancing semiconductor technology.
Conclusion
Asahi Kasei's new photosensitive polyimide film represents a significant advancement in semiconductor packaging technology. By improving efficiency and precision, it supports the increasing demands of AI chip manufacturing. This innovation highlights the company's commitment to technological progress and the important contributions of its leadership team.